Based on the QPA2237 chip, we have built a transmitter with a power of 10W, covering a frequency range from 30M to 2500M. During the testing, we found that under static conditions (without input) or with a small power input, the problem of the chip would keep increasing and would exceed 150 degrees Celsius. We adopted the backside of the chip specially designed for heat dissipation, and used heat sinks for cooling. May I ask, for the QPA2237 chip, is there anything that needs to be particularly noted when it comes to heat dissipation?
Below are the pictures of our board cards and the scenarios of heat dissipation. We would like to know at what temperature QPA2237 can operate safely.
