RF Forum Poll for May/June 2026

RF Solutions RF Power Amplifiers
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RF Challenge of the Month: Evaluation Boards

Evaluation boards are meant to validate performance quickly. But results don’t always match expectations once you get into the lab.

What causes the most confusion when working with RF evaluation boards?

• Reference plane or de-embedding differences
• Biasing issues or device not powering correctly
• Measured performance not matching datasheet
• Unclear measurement setup or test conditions

Qorvo Take:
Evaluation boards are a critical step in validating RF performance, but differences between datasheet data and lab results can create confusion. One of the most common issues is misunderstanding the reference plane. Datasheet performance is often de-embedded, while EVB measurements include losses from the board, connectors, and transitions. Without proper de-embedding, results may appear degraded.

Biasing is another frequent challenge. Incorrect pin connections, sequencing, or unexpected current draw can prevent devices from powering correctly. For amplifiers, proper bias conditions are critical. Excess current or abnormal behavior at the bias pins can indicate a wiring issue or possible device damage, while incorrect sequencing can lead to unreliable performance.

Qorvo Insight: Most EVB issues come down to reference plane awareness, correct biasing, and alignment between test setup and datasheet conditions. When these are understood, EVBs become a reliable path to system validation.
If you’ve run into issues during bring-up or measurement, share what happened and how you resolved it.

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For Qorvo high power amplifiers (HPA) the device temperature is another important consideration during evaluation. Temperature difference is a very common reason for customer evaluation results to vary from those expected. If testing at room temperature, for example, the power dissipation in the HPA results in the device temperature being much higher, and this will impact performance significantly.
The temperature referenced in Qorvo HPA datasheet plots/specs is typically Tbase, which is the temperature of the ground pad on the device package underside.
Most of the Qorvo HPA evaluation boards have a slot in the carrier to accept a thermocouple. During evaluation the carrier temperature can be monitored and using an offset provided the device Tbase can be estimated. If comparing to datasheet plots then Tbase needs to be held at the correct temperature, typically achieved using a cold plate that the carrier is mounted on.