QPA2237 vs TGM2237-SM for space application

RF Solutions RF Power Amplifiers
1

Hello,

I have a few questions regarding the TGA2237-SM & QPA2237:

  1. Do you recommend one or the other (or neither?) TGA2237-SM vs. QPA2237 for a space application? Thus far in reviewing the datasheets, they look to be similar, if not the same, designs in different packages.

  2. Does Qorvo perform in-house, or 3rd party up-screening of space flight parts?

  3. Is there any space flight heritage for either or both parts that you are aware of?

Thank you.

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  1. The QPA2237 and TGA2237-SM use the same die. The die is also available as p/n TGA2237. The QPA2237 is a plastic over mold QFN, whereas the TGA2237-SM is an air cavity package with ceramic laminate. Neither package type is particularly well suited for space applications, but it depends on the exact requirements.
  2. Yes Qorvo performs space up-screening.
  3. I don’t believe the TGA2237 die has been space qualified or used in space. However the GaN process is space qualified with flight heritage.
    For more details please contact appsupport@qorvo.com stating your company name and location.