I will be using QPA2237 on a board, and will need to cool the component from the bottom of the device as well as the top of the device. The datasheet gives thetaJC,bottom information. Is thetaJC,top information available as well?
Qorvo doesn’t normally specify thermal resistance to the top of the package. This is because the dominant heat flow path is through the package underside into the PCB. This means that PCB design and mounting is very important to get the heat out of the bottom of the device, you can follow layout recommendations in the datasheet and the eval board design. Trying to cool the device from the top side may not help very much. It’s not normally done on MMICs like this.