I discussed this internally, my short answer for now is: it’s complicated, and we plan to document this better.
In general it seems like I was wrong about the ferrite beads in my previous comment. The ferrite beads are primarily used to isolate noise between VDDPA1 and VDDPA2. This mainly has effect on the bandwidth of the transmitted signal, and thus on the performance. I should not not impact EMI to much (it should be OK for certification).
I’m a fairly new hire, so I have more spare time to answer forum posts, but sadly I don’t have that much background. Sadly the person that would know most about this is currently not in the office and is busy with new designs, so I started an internal mail thread about this. It could take some time to have a proper answer. I (or someone that knows more) will provide an update you once we have more information and hopefully we can improve our documentation on this in the future.
For now I would suggest the “ANDY” option. The 22uF are not strictly needed as far as I understand, but as @AndyA mentioned having more capacitors is typically a better option than having too little. The 22uF caps can always be left unconnected. Just make sure to avoid stubs. See also section 6.2 and 6.3 in the hardware design guide (APH001) and section 7.2.31.1 of the DW1000 user manual:
It should be noted that if you plan to use DA setting 000 you must ensure good isolation between pins VDDPA1 and VDDPA2 otherwise this setting may result in compression of the TX signal. ( Good isolation requirIate PCB tracks to each of these pins. )