May I know if there are data available for θJB and θJCtop of CMD295C4?
The CMD295C4 datasheet specifies Thermal Resistance θjc as 95°C/W, where the case ‘c’ is the ground pad on the bottom of the QFN package. Qorvo doesn’t normally supply thermal resistance to the top of package. The dominant path for heat dissipation is through the bottom of the package and into the PCB.