hi:
when i read dwm1000-datasheet,Internally trimmed to +/- 2 ppm in Chapter of 4.5.1。
“By using the temperature monitoring capability of the DW1000 chip on the DWM1000 module it is possible to dynamically trim the crystal during run time to maintain the +/- 2ppm specification over the full temperature range of operation ”
1、it means when we do not use TCXOs,it can dynamically trim the crystal during run time to maintain the +/- 2ppm?
2、how to enable temperature monitoring capability to dynamically trim the crystal during run time to maintain the +/- 2ppm?
but in dw1000 datasheet ,the chapter of 8.1 , it suggests us to use TCXOs。 TDOA
Best regards